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TRUMPF makes glass substrates ready for the next generation of AI chips

The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors.

Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips

Advanced packaging requires integrated cooling at the semiconductor level // TRUMPF uses ultrashort-pulse lasers to enable the industrial production of the microstructures needed for this // Ultra-fine structures are created directly within the chip stack

Sino Land reports 13.3% revenue growth and a 14.2% increase in net profit attributable to shareholders for FY2025/26

Awarded first pilot area in the Northern Metropolis, demonstrating the Group’s confidence in Hong Kong’s prospects

InnoHK R&D Centres Establish Base at Science Park to Drive Emerging Industries and Pioneer Future Innovation
HONG KONG SAR – Media OutReach Newswire – 1 September 2026 – Hong Kong Science and Technology Parks Corporation (HKSTP), in collaboration with the Innovation and Technology Commission, successfully hosted the launch ceremony for the third InnoHK researc
Bintai Kinden capai persetujuan cadangan penyelesaian RM24.7 juta dengan Universiti Islam Melaka

KUALA LUMPUR 1 Sept - Bintai Kinden Corporation Bhd (Bintai Kinden) melalui anak syarikat milik penuhnya, Optimal Property Management Sdn Bhd (OPM), telah mencapai rangka kerja penyelesaian dengan Universiti Islam Melaka Bhd (UIMB) berhubung perjanjian konsesi membabitkan kemudah

PPB lantik cucu Robert Kuok, Kuok Meng Xiong sebagai Pengarah Urusan Kumpulan

KUALA LUMPUR 1 Sept — Selepas hampir tempoh dua dekad menerajui PPB Group Berhad, Lim Soon Huat bersara daripada jawatan Pengarah Urusan Kumpulan (GMD) dan Lembaga Pengarah syarikat itu.

 

DFI Retail Group Announces New Group Chief Digital & yuu Rewards Officer

The appointment takes effect on 17 September 2026

VSTECS jual 40% pegangan dalam ISATEC kepada Skyform dari Singapura pada harga RM49 juta

KUALA LUMPUR 1 SeptVSTECS Berhad bakal menjual keseluruhan 40% ekuiti dalam ISATEC Sdn Bhd pada harga RM48.75 juta selepas pelaburan itu berjaya mencipta nilai sepanjang tempoh tujuh tahun.

 

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